Daniela Staiculescu's Photo

daniela@ece.gatech.edu

Daniela Staiculescu

Daniela Staiculescu received the B.S. degree in Electrical Engineering from the Polytechnic University, Bucharest, Romania, in 1993, and the M.S. and Ph.D. degrees from Georgia Institute of Technology, in 1999 and 2001, respectively. She has been with RF Solutions in Atlanta, GA, between 2001 and 2003, a senior research engineer in ATHENA group between 2003 and 2009, and currently is a research engineer in Prof. CP Wong's group in the Materials Science department at Georgia Tech. Her research interests are new materials and technologies for an energy sustainable 21st century.

She has published 50 papers, filled one invention disclosure and co-authored two book chapters. She is a reviewer for major IEEE journals, IMS TPC member and involved in Steering committees of major IEEE conferences and workshops.

Conference Papers (published with ATHENA)

    2008
    1. Yang L., Martin L., Staiculescu D., Wong C.P., Tentzeris M.M. - Design and Development of COmpact Conformal RFID Antennas Utilizing Novel Flexible Magnetic Composite Materials for Wearable RF and Biomedical Applications Proc. of the 2008 IEEE-APS Symposium, pp.1-4, San Diego, CA, July 2008 Student Paper Competition Honorable Mention.
    2. Yang L., Martin L., Staiculescu D., Wong C.P., Tentzeris M.M. - A Novel Flexible Magnetic Composite Material for RFID, Wearable RF and Bio-monitoring Applications Procs. of the 2008 IEEE-IMS Symposium, pp.963-966, Atlanta, GA, June 2008 Student Paper Competition Honorable Mention
    2007
    1. Placentino F., Staiculescu D., Nikolaou S., Martin L., Scarponi A., Alimenti F., Roselli L., Tentzeris M.M. - Concurrent Circuit-Level/System-Level Optimization of a 24GHz Mixer for Automotive Applications Using a Hybrid Electromagnetic/Statistical Technique Proc. of the 2007 IEEE-IMS Symposium, pp.1217-1220, Honolulu, HI, June 2007.
    2. Martin L., Staiculescu D., Li H., Ooi S.L., Wong C.P.,Tentzeris M.M. - Investigation of the Impact of Magnetic Permeability and Loss of Magnetic Composite Materials on RFID and RF Passives Miniaturization Proc. of the 2007 IEEE CEM-TD Symposium, pp.1-4, Perugia, ITALY, October 2007.
    3. DeJean G., Staiculescu D., Martin L., Onyewuchi U., Li R.L., Tentzeris M.M. - Hybrid Statistical/Electromagnetic Optimization and Performance Capability Modeling of an LTCC Compact Soft/Hard Surface Structure Proc. of the 2007 IEEE-APS Symposium, pp.5749-5752, Honolulu, HI, June 2007.
    2006
    1. You C., Staiculescu D., Martin L., Hwang W., Tentzeris M.M. - Efficient Co-Design of Composite Smart Structures (antennas and mechanical structures) Using a Novel Hybrid Optimization Technique Procs. of the 2006 IEEE-APS Symposium, pp.569-572, Albuquerque, NM, July 2006.
    2. Staiculescu D., You C., Martin L., Hwang W., Tentzeris M.M. - Hybrid Electrical/Mechanical Optimization Technique Using Time-Domain Modeling, Finite Element Method and Statistical Tools for Composite Smart Structures Procs. of the 2006 IEEE MTT-S International Microwave Symposium Digest, pp.288-291, San Fransisco, CA, June 2006.
    3. Staiculescu D., Martin L., Tentzeris M.M. - Multilayer Embedded Metamaterial Optimization for 3D Integrated Module Applications Procs. of the 2006 IEEE-APS Symposium, pp.4137-4140, Albuquerque, NM, July 2006.
    4. Staiculescu D., Martin L., Lee J., Tentzeris M.M. - Performance Capability Modeling And Optimization Of RF/Millimeter Wave Integrated Functions And Modules Using A Hybrid Statistical/Electromagnetic Technique That Includes Process Variations Procs. of the 2006 36th European Microwave Conference, pp.474-477, Manchester, England, September 2006.
    2005
    1. Vasiloglou N., Staiculescu D., Tentzeris M.M. - Investigation of the Effect of Fractal Shapes on the Broadband Behavior of One-Dimensional Optimized Antennas Proc. of the 2004 URSI Symposium, p.69, Monterey, CA, June 2004.
    2. Staiculescu D., Martin L., Tentzeris M.M. - 40 GHz Metamaterial Development using Hybrid Electromagnetic/Statistical Tools Procs. of the 2005 IEEE CEM-TD Workshop, pp.110-113, Atlanta, GA, September 2005.
    3. Staiculescu D., Bushyager N., Tentzeris M.M. - Microwave/Millimeter-Wave Metamaterial Development Using the Design of Experiments Technique Procs. of the 2005 IEEE/ACES Int. Conf. on Wireless Communications and Applied Computational Electromagnetics, pp.417-420, Honolulu, HI, April 2005.
    4. Staiculescu D., Bushyager N., Martin L., Tentzeris M.M. - Design of Millimeter-Wave Metamaterials Using Deterministic Full-Wave Electromagnetic Simulators and Patch of Ascent Statistical Optimizer Procs. of the 2005 IEEE-ECTC Symposium, pp.1565-1568, Orlando, FL, June 2005.
    5. Martin L., Staiculescu D., Tentzeris M.M. - Design and Optimization of 3D Multilayer Balun Architectures Using the Design of Experiments Technique Procs. of the 2005 IEEE-APS Symposium, pp.93-96, vol.1A, Washington, DC, July 2005.
    6. Bushyager N., Staiculescu D., Obatoyinbo A., Tentzeris M.M. - Optimization of 3D Multilayer RF Components using the Design of Experiments (DOE) Technique Proc. of the 2004 IEEE-IMS Symposium, pp.1859-1862, Fort-Worth, TX, June 2004.
    2004
    1. Bushyager N., Staiculescu D., Martin L., Lee J., Vasiloglou N., Tentzeris M.M. - Design and Optimization of 3D RF Modules, Microsystems and Packages Using Electromagnetic and Statistical Tools Proc. of the 2004 IEEE-ECTC Symposium, pp.1412-1415, Las Vegas, NV, June 2004.
    2003
    1. Pratap R.J., Pinel S., Staiculescu D., Laskar J., May G. - A Neural Networ Model for Sensitivity Analysis of Circuit Parameters for Flip-Chip Interconnects Proc. of the 2003 ECTC Conference, New Orleans, LA, May 27-30, 2003, pp. 1619-1625.
    2001
    1. Laskar J., Sutono A., Staiculescu D., Lee C.H., Davis M., Lim K., Tentzeris M.M. - Multilayer 3D System-on-Package (SOP) Architectures for Highly Integrated Microwave and Millimeter Wave Radio Front-End Proc. of 2001 SMTA Conference, Chicago, IL, September, 2001.
    2000
    1. Tentzeris M.M., Staiculescu D., Cafaro N.G., Laskar J. - Design and Optimization of Novel RF Packaging Structures Using Multiresolution and Statistical Schemes Invited Paper, PIERS 2000, Boston, MA, July 5-14, 2000, p.384.
    2. Staiculescu D., Sutono A., Laskar J. - Wideband Scaleable Electrical Model for Microwave/MIllimeter Wave Flip-Chip Interconnects Proc. of the 2000 EPEP Topical Meeting, Scottsdale, AZ, 2000, pp. 99-102.
    3. Staiculescu D., Laskar J., Tentzeris M.M. - Flip Chip Design Rule Development for Multiple Signal and Ground Bump Configurations Proc. of the 2000 Asia-Pacific Microwave Conference Sydney, Australia, December, 2000,pp.136-139.
    4. McGarvey B., Staiculescu D., Tentzeris M.M., Laskar J. - Adaptive Modeling of Complex Packaging Geometries Using Haar-based MRTD Algorithms Proc. of the 2000 European Microwave Conference, Paris, France, October, 2000, pp.413-416.
    1999
    1. Staiculescu D., Laskar J., Mendelsohn J., Sweetman E., Rudy D., Artaki I. - Ni-Au Surface Finish Effects on RF Performance Proc. of the 1999 IMS Symposium, Annaheim, CA, 1999, pp. 1909-1912.
    2. Staiculescu D., Laskar J., Mather J. - Design Rule Development for Microwave Flip-Chip Applications Proc. of the 1999 EPEP Topical Meeting, San Diego, CA, October 25-27, 1999, pp. 231-234.
    1998
    1. Staiculescu D., Pham A., Laskar J., Consolazio S., Moghe S. - Analysis and Performance of BGA Interconnects for RF Packaging Proc. of the 1998 RFIC Symposium, Baltimore, MD, June 7-9, 1998, pp. 131-134.
    2. Staiculescu D., Liang H., Laskar J., Mather J. - Full Wave Analysis and Development of Circuit Models for Flip-Chip Interconnects Proc. of the 1998 EPEP Topical Meeting, West Point, NY, October 26-28, 1998, pp. 241-244.
    3. Laskar J., Jokerst N., Brooke M., Harris M., Chun C., Pham A., Liang H., Staiculescu D., Sutono A. - Review of Packaging Research at Georgia Tech's PRC Proc. of the Advanced Packaging Materials, Braselton, GA, March 15-18, 1998, pp. 139-150.

    Journal Papers (published with ATHENA)

      2008
      1. You C., Staiculescu D., Martin L., Tentzeris M.M. - A novel hybrid electrical/mechanical optimization technique using time-domain modeling, finite element method and statistical tools for co-design and optimization of RF integrated mechanical structures International Journal of Numerical Modeling, Vol.21, No.1-2, Jan-April 2008, pp. 91-101.
      2. Yang L., Martin L., Staiculescu D., Wong C.P., Tentzeris M.M. - Conformal Magnetic Composite RFID for Wearable RF and Bio-Monitoring Applications IEEE Transactions on Microwave Theory and Techniques, Vol.56, No.12-2, pp.3223-3230, December 2008.
      2005
      1. Staiculescu D., Bushyager N., Obatoyinbo A., Martin L., Tentzeris M.M. - Design and Optimization of 3D Compact Stripline and Microstrip Bluetooth/WLAN Balun Architectures using the Design of Experiments Technique IEEE Transactions on Antennas and Propagation, Vol.53, No.5, pp.1805-1812, May 2005.
      2. Pratap R.J., Pinel S., Staiculescu D., Laskar J., May G. - Modeling and Sensitivity Analysis of Circuit Parameters for Flip-Chip Interconnects Using Neural Networks IEEE Transactions on Advanced Packaging, pp. 71-78, Feb.2005.
      2004
      1. Tentzeris M.M., Staiculescu D., Lim K., Pinel S., Laskar J., Tummala R. - RF/Wireless Packaging Invited Chapter for the book: "Encyclopedia of RF and Microwave Engineering", edited by K.Cheng, published by Wiley Eds., May 2004.
      2. Pinel S., Tentzeris M.M., Staiculescu D., Lim K., Laskar J. - RF/Wireless Packaging Invited Chapter for the book "Encyclopedia of RF and Microwave Engineering", Wiley Eds., May 2004.
      2003
      1. Staiculescu D., Laskar J., Tentzeris M.M. - Design of experiments (DOE) technique for microwave/millimeter wave flip-chip optimization International Journal of Numerical Modeling, Vol.16, pp.97-103, 2003.
      2002
      1. Staiculescu D., Lim K., Sutono A., Liang H., Tentzeris M.M., Laskar J. - Flip-Chip vs. Wirebond Printed Circuit Design Magazine, pp.12-16, June 2002.
      2001
      1. Staiculescu D., Sutono A., Laskar J. - Wideband Scaleable Electrical Model for Microwave/Millimeter Wave Flip-Chip Interconnects IEEE Advanced Packaging Transactions, pp. 255-259, September 2001.
      2000
      1. Staiculescu D., Laskar J., Tentzeris M.M. - Design Rule Development for Microwave Flip-Chip Applications IEEE MTT Transactions, Vol.48, No.9, pp.1476-1481, September 2000.




      • "Radial Multiple Ground Bump Configurations", with Joy Laskar, patent No. US 6,624,521 B2, Sep. 23, 2003