Napol Chaisilwattana
Conference Papers (published with ATHENA)
2008
- Rida A., Yang L., Chaisilwattana N., Travis S., Bhattacharya S., Tentzeris M.M. - 3D Packaging Architecture Using Paper as a Dielectric Medium Procs. of the 2008 IEEE-ECTC Symposium, pp.371-373, Orlando, FL, May 2008.